Bambu Lab High Temperature Plate (PEI)

Bambu Lab Bambu Lab

Bambu High-Temperature Plate er et klistermærke, der er blevet påsat Bambu Engineering Flex Plate

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40-005

298,00 DKK

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Overview:

The Bambu High-Temperature Plate is a sticker that has been applied to the Bambu Engineering Flex Plate. When the sticker is consumed you can replace the sticker with a new High Temp or cool sticker. This is a consumable printing surface that is used in conjunction with a thin coat of glue stick and works well with most common filaments.
The Bambu High-Temperature Plate leaves a smooth finish to the model that comes in contact with the High-Temperature Plate, and might require a bit of post-processing for cleaning up the glue stick.

Recommended settings for Bambu High-Temperature Plate

These are some recommendations for settings to get the best results while using the Bambu High-Temperature Plate. Please note that these settings are just a recommendation, and other slicer settings might need to be adjusted based on the printed model and the filament requirements.
Material
Hotbed temperature
Glue Stick Required?
Upper Glass Cover Plate Removed?
PLA
45℃~60℃
Recommended
Yes
ABS
90℃~100℃
Recommended
No
PETG
80℃
Yes
Yes
TPU
35℃
Recommended
Yes
ASA
90℃~100℃
Recommended
No
PVA
45℃~60℃
Recommended
Yes
PLA CF
45℃~60℃
Recommended
Yes
PLA GF
45℃~60℃
Recommended
Yes
PC
100℃~110℃
Yes
No
PA
100℃~110℃
Yes
No
PA CF
100℃~110℃
Yes
No

Recommended settings for Bambu Engineering Plate

These are some recommendations for settings to get the best results while using the Bambu Engineering Plate. Please note that these settings are just a recommendation, and other slicer settings might need to be adjusted based on the printed model and the filament requirements.
Material
Hotbed temperature
Glue Stick Required?
Upper Glass Cover Plate Removed?
TPU
30℃~35℃
Recommended
No
PC
100℃~110℃
Yes
No
PA
100℃-120℃
Yes
No
PA CF
100℃~120℃
Yes
No
The Bambu High-Temperature Plate is a sticker applied on the flexible magnetic build plate that can support a square area of 256*256mm with rounded corners. It is suitable for all Bambu 3D Printer models.

Benefits of using the Bambu High-Temperature Plate

  • Works best with most 3D printing filaments
  • Works well with the Automatic Calibration for Flow rate and does not interfere with the LIDAR
  • Smooth texture on the surface of the print
  • Excellent adhesion and easy print removal
  • Can be replaced by the user

Downsides to using the Bambu High-Temperature Plate

  • It cannot be used without heating the printing surface
  • Can be more fragile compared to the Engineering Plate
  • The upper glass cover plate, and the front glass door need to be opened for filaments with a low glass transition temperature.

Considerations for using the Bambu High-Temperature Plate

  • It is recommended to apply a uniform thin coat of glue stick, to ensure a longer lifetime for the Cool Plate, especially for filaments like PETG, TPU and PC
  • Regularly clean the print surface with dish soap and hot water to eliminate any dust or grease residue, which might cause bad adhesion.
  • Do not clean the High-Temperature Plate with Acetone, as it might damage the surface.
  • Always wait for a few minutes before removing printed models to allow them to cool down for easy print removal and avoid bubbles forming underneath the printing surface.

Installation steps

When installing the Bambu High-Temperature Plate, please use the location of the text to help you install the plate in the correct orientation. The upper left and right rounded corners of the High-Temperature Plate should be aligned with the left and right fixed points of the heating platform, and gently lowered to be secured by the magnet.
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Technical Specifications

Material
Engineering steel plate + Cool Plate sticker
Surface temperature resistance
Up to 200℃
Flexible spring steel thickness
0.5 mm
High-Temperature sticker thickness
0.3 mm
Usable print size
256*256 mm
Package size
290*290*4 mm
Package weight
320g
Color
Dark Grey